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Title: Flux/underfill Compatibility Study for Flip-chip Assembly Process
Authors: Phuthanate Phoosekieaw and Sanya Khunkhao
Keywords: Flip chip, Underfill, Tacky flux
Issue Date: 28-May-2011
Publisher: IACSIT Press, Singapore
Citation: Flip chip, Underfill, Tacky flux
Series/Report no.: Vol.6
ICIEE 2011 Session 9
Abstract: The rapid uptake of flip-chip technology within the electronics industry due to their better thermal performance, smaller size, lower profile, light weight, and higher input/output density, the solder joints together with underfill in flip chip package serve as a mechanical mechanism for resisting the thermal deformation induced by the coefficient of thermal expansion (CTE) mismatch between silicon die and substrate. underfill materials are employed in flip-chip assemblies to enhance solder joint reliability performance. The adhesion of underfills with solders is important to the integrity of the flip-chip structure. The effect of temperature and humidity aging as well as flux residue on adhesion strength was also investigated.
ISBN: 978-981-08-8637-0
ISSN: 2010-460X
Appears in Collections:บทความวิชาการ

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