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Title: | Flux/underfill Compatibility Study for Flip-chip Assembly Process |
Authors: | Phuthanate Phoosekieaw and Sanya Khunkhao |
Keywords: | Flip chip, Underfill, Tacky flux |
Issue Date: | 28-May-2011 |
Publisher: | IACSIT Press, Singapore |
Citation: | Flip chip, Underfill, Tacky flux |
Series/Report no.: | Vol.6 ICIEE 2011 Session 9 |
Abstract: | The rapid uptake of flip-chip technology within the electronics industry due to their better thermal performance, smaller size, lower profile, light weight, and higher input/output density, the solder joints together with underfill in flip chip package serve as a mechanical mechanism for resisting the thermal deformation induced by the coefficient of thermal expansion (CTE) mismatch between silicon die and substrate. underfill materials are employed in flip-chip assemblies to enhance solder joint reliability performance. The adhesion of underfills with solders is important to the integrity of the flip-chip structure. The effect of temperature and humidity aging as well as flux residue on adhesion strength was also investigated. |
URI: | http://dspace.spu.ac.th/handle/123456789/2441 |
ISBN: | 978-981-08-8637-0 |
ISSN: | 2010-460X |
Appears in Collections: | บทความวิชาการ |
Files in This Item:
File | Description | Size | Format | |
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rp047_ICIEE2011-E20007.pdf | 837.63 kB | Adobe PDF | View/Open |
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