Flux/underfill Compatibility Study for Flip-chip Assembly Process
กำลังโหลด...
วันที่
2554-05-28
ชื่อวารสาร
วารสาร ISSN
ชื่อหนังสือ
สำนักพิมพ์
IACSIT Press, Singapore
เชิงนามธรรม
The rapid uptake of flip-chip technology within the electronics industry due to their better thermal performance, smaller size, lower profile, light weight, and higher input/output density, the solder
joints together with underfill in flip chip package serve as a mechanical mechanism for resisting the thermal deformation induced by the coefficient of thermal expansion (CTE) mismatch between silicon die and substrate. underfill materials are employed in flip-chip assemblies to enhance solder joint reliability performance. The adhesion of underfills with solders is important to the integrity of the flip-chip structure. The effect of temperature and humidity aging as well as flux residue on adhesion strength was also investigated.
คำอธิบาย
คำหลัก
Flip chip, Underfill, Tacky flux
การอ้างอิง
Flip chip, Underfill, Tacky flux